Packaging material of the hottest curing compositi

2022-09-23
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Packaging material of curing composition

patent name: packaging material of curing composition patent applicant sun Ink Manufacturing Co., Ltd; Address of the principal applicant of Fujimori Industries Co., Ltd. Tokyo, Japan inventor Masako shimanua; Yufuzi; Hideyoshima; Kawasaki fujise; Sasaki Zhao; Murata Sui; Application No. of rangu Chongwen (patent meeting conditions in strict accordance with the standard) 4. Application date: June 3, 2003. Date of issuance. Approval Announcement No. approval announcement date: August 24, 2005. CD No. d0534. Main classification No. b65d65/40. Classification No. b65d65/40; B32B15/08; B65D30/02; B32b7/06 division original application No. priority item 2002.6.4 JP 163182/2002 abstract the invention provides a packaging bag material with this structure, which has a sealing adhesive layer 1 formed by a synthetic resin layer that can be heat sealed on the inner surface and a metal film layer. The market supervision department will promote all localities and departments to increase the publicity of enterprise related charges. 7 the isolation layer 3 is laminated with an extruded polyethylene layer 2 between the sealing adhesive layer and the isolation layer, A synthetic resin layer 6 that can be stripped from the polyethylene layer is arranged on the interface between at least either of the sealing adhesive layer and the isolation layer and the extruded polyethylene layer. The metal film layer is preferably aluminum foil or aluminum vapor coating. The packaging material with this structure is particularly suitable for use as packaging material for curing compositions such as photoresist inks or adhesives, coatings, printing inks, etc. Claim 1. A packaging bag material of a curing composition, which has a structure formed by laminating a sealing adhesive layer formed by a synthetic resin layer that can be heat sealed on the inner surface, an isolation layer containing a metal film layer and extruded polyethylene between the sealing adhesive layer and the isolation layer, which is characterized in that at least one of the sealing adhesive layer and the isolation layer is at the interface with the extruded polyethylene layer, A synthetic resin layer that can be stripped from the polyethylene layer is provided. International application pct/jp2003/0 point load extension, elastic modulus, elongation, stripping interval Zui large value, Zui small value, average value, net energy Turn back energy 07035 2003.6.3 international publication wo2003/101859 2003.12.11 date of entry into the country patent agency Yongxin patent and Trademark Agency Co., Ltd. institutional address agent Chen Jianquan

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